Through Hole (THT) mounting

The lead-out assembly shop at our production facility includes a selective soldering section, a wave soldering section, a section for additional soldering of lead-out elements (after installing SMD components) and a manual assembly section (for small series and prototypes).  ( THT assembly)

Selective soldering / wave soldering 

For the assembly of medium and large batches of leaded components, we use a selective soldering machine or wave soldering machine. 

Selective soldering is a relatively new technology that allows for selective assembly of only lead-out components. The method requires a minimum of modifications to optimize printed circuit boards for this technology and allows for the assembly of most existing types of lead-out components. Assembly productivity is several times higher than manual assembly.

Wave soldering is another assembly method used in our production. This method allows to significantly increase the assembly productivity (in comparison with selective soldering) and, accordingly, reduce the cost of the product. However, to use it, the printed circuit board must be optimized for this technology: as a rule, the leaded components must be located on the same side as the planar (SMD) components, or the SMD components must be pre-installed on glue.


Advantages of Selective and Wave Soldering

• The automated process ensures high quality and repeatability of installation.
• Soldering in a nitrogen environment provides higher quality soldered joints due to the absence of the oxidation process.
• Due to the high repeatability of soldering, automatic optical inspection of soldered joints is used, which in turn leads to a reduction in order fulfillment time.
• These technologies allow to significantly reduce labor intensity and time costs, as a result reducing the order fulfillment time and the cost of products.